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LTM4607
APPLICATIONS INFORMATION
Layout Checklist/Example
The high integration of LTM4607 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
?  Use large PCB copper areas for high current path, includ-
ing V IN , R SENSE , SW1, SW2, PGND and V OUT . It helps to
minimize the PCB conduction loss and thermal stress.
?  Place high frequency input and output ceramic capaci-
tors next to the V IN , PGND and V OUT pins to minimize
high frequency noise
?  Route SENSE – and SENSE + leads together with minimum
PC trace spacing. Avoid sense lines passing through
noisy areas, such as switch nodes.
?  Place a dedicated power ground layer underneath the
unit.
?  To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between the top layer and other power layers
?  Do not put vias directly on pads, unless the vias are
capped.
?  Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
Figure 15. gives a good example of the recommended
layout.
SW1
L1
SW2
V IN
V OUT
C OUT
PGND
+ –
SGND
R SENSE
R SENSE
PGND
C IN
4607 F15
KELVIN CONNECTIONS TO R SENSE
Figure 15. Recommended PCB Layout
20
For more information www.linear.com/LTM4607
4607fc
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